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Features
● Uniform thickness is achieved by roll-to-roll process.
● Excellent adhesion to PI and metal.
● Adjustable appearance and thickness
Product performance
Characteristic |
Value |
Unit |
Testing method |
|
Material thickness(PI) |
25 |
㎛ |
||
Plating thickness |
Cu |
1.5~2.5 |
㎛ |
X-ray Fluorescence |
Sn |
1.0~1.5 |
|||
bright tin |
||||
Electroplating color |
Ra : 0.1±0.1 |
㎛ |
||
Roughness |
15~20 |
mΩ |
||
Surface impedance |
Pass |
ASTM D3359-09 |
||
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